Focus on the localization of semiconductor packaging die-cutting technology
2025/07/02

This technology builds a micron-sized titanium-aluminum-nitrogen composite layer on the surface of the knife body through a physical vapor deposition (PVD) process, increasing the hardness to HV3800 and reducing the coefficient of friction by 40%. It is particularly suitable for precision die-cutting of high-adhesive materials such as self-adhesive labels and medical tapes.


After third-party testing, the new cutting tool has a 50% longer lifespan than conventional products when continuously cutting silicone backing materials, and effectively reduces the phenomenon of glue overflow at the material edges. At present, this technology has been applied to the tape production lines of enterprises such as 3M and Avery Dennison. "Coating adhesion is A common problem in the industry," said the person in charge of the company's materials laboratory. "Through the innovation of the substrate pretreatment process, we have enabled the coating adhesion to reach Class A of the international standard ASTM C1624."